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Home > Products > Organic ORGANIC "HDBU" (High Density Build Up) Organic Package Technology that is first in the industry to employ "Laser Via" method. A New Built-up Epoxy Resin PCB Technology for High Density Surface Mount Package and Device Attachment.* To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information. *NOTE: In order to view this link, you will need Adobe Acrobat Reader. Download Adobe's Acrobat Reader.

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