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THIN FILM
Kyocera offers thin film metallization for a variety of ceramic substrates including Aluminum Oxide, Aluminum Nitride, and Beryllium Oxide. In addition, Kyocera has the ability to metallize the surface of cofired multilayer AlN and Alumina substrates allowing for higher density circuitry on these packages.
Some advantages of Kyocera thin film include precise positional tolerances, the ability to withstand brazing temperatures and fine line capabilities.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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