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T/R MODULES
MCM's are beginning to be applied in modern Radio Frequency (RF) systems including active electronically scanned arrays (AESA). Conventional RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz — a spread of over eight octaves. The development of Monolithic Microwave Integrated Circuit (MMIC) and Application Specific Integrated Circuit (ASIC) semiconductor technology has given rise to wider usage of analog and mixed mode (analog and digital) MCM designs within the AESA. The challenge to the MCM designer is the incorporation of passive and active RF and DC components within a single MCM package.
This MCM, known as a transmit/receive (T/R) module reside within the AESA. Microwave, power conditioning, and digital circuitry is routing within a single housing to yield a truly 3D, integrated T/R module package.
To meet the light-weight, low-cost packaging requirements of these systems, Kyocera is aggressively developing a microwave-grade materials and design techniques to meet the stringent packaging requirements of airborne transmit/receive modules, digital and analog systems, and RF/microwave subsystems.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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