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Home > Services > Flip Chip Packaging > Assembly Processes Assembly Processes Ceramic Substrate Metallization - Ni/Au Bump Structure - Pb/Sn: 63/37, 97/3 - Capability to 150µm pitch Second Level Ball Grid Array Technology - Capability to 0.5mm pitch - Eutectic, High Lead, DBGA Organic Substrate Metallization - Cu/OSP - Cu/Ni/Au Bump Structure - Pb/Sn: 63/37, 97/3 in 63/37 - Capability to 150µm pitch Second Level Ball Attach - Capability to 0.5mm pitch - Eutectic  Related link

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