Global      U.S.A.      Semiconductor Parts

Home      About      Products      Applications      Technology      Services      Extranet

Services Flip Chip Packaging Production Capabilities Process Lines Burn-In Services Assembly Processes RFQ Sheet Assembly Flow Test Services Wire Bond Packaging (SCA) Plating Services

Home > Services > Flip Chip Packaging > RFQ Sheet Please take a moment to fill out the form below Complete list of Regional Offices. Or contact us at:   Kyocera America, Inc. 8611 Balboa Avenue San Diego, CA 92123-1580 Tel: (858) 576-2600 Fax: (858) 569-9412 E-mail: kaicorp@kyocera.com Name:   Title:   Institution/Employer:   Address 1:   Address 2:   City:   State/Province:   Zip (Postal Code):   E-Mail Address:   Telephone Number:   Fax Number:   Please write any special instructions or questions in the box below. We will contact you as soon as possible: Package Type Number of IO's Quantity Die Material Die I/O Technology Flipchip Wirebond Both Pitch Low-K Dielectric?    Number of Passives Thermal Dissapation (W) Process Flow Class B Class S Commercial Mil Std. Wafer Diameter Backlapping Die Size Wafer Quantity Good Die Yield Turnaround Time Electrical Test Type Device Type  Related link

Home > Services > Flip Chip Packaging > RFQ Sheet Page Top

Contact     Terms of use     Privacy     Sitemap