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Home > Services > Flip Chip Packaging > Test Services
Flip Chip Packaging
Test Services

TEST COMPETENCIES


Product Engineering

  • Test Plan
  • Program Development
  • Hardware Design
  • Characterization
  • Yield Analysis
  • Prototype and Production Tests
  • Turnkey Operation - US/Offshore
Quality & Reliability Engineering

  • Quality/Reliability Plan
  • Hardware Design
  • Test Pattern
  • Qualification
  • Failure Isolation
  • Failure Analysis


Tester Platforms Worldwide Equipment
Credence SC-212 256 Pins Failure Analysis Tools
Credence DUO 384 Pins Schlumberger FIB (PX2)
LT 1101/1001 512 Pins Schlumberger Ebeam 10000
Teradyne J-921 384 Pins IDS 5000 Ebeam
LTX Synchro Master/ Trillium Micro Master   LTX Synchro Master
HP 83000 384 Pins Handlers
HP 94000 80 Pins Seiko Epson Pick and Place
HP Versatest-2104   Syntax 121
STS 8256 256 Pins JLSI
STS 32 Pins Various Soic & Dip Handlers
S21 120 Pins Probers
ITS 9000 448 Pins EG 4095, 4080, 2001, 4085
Advantest 3340 256 Pins TSK
Sentry 20 256 Pins  
HP 8200 480 Pins  
IMS Mixed Signal Test Systems  
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