Global      U.S.A.      Semiconductor Parts

Home      About      Products      Applications      Technology      Assembly Services      Plating Services      Extranet

Assembly Services Flip Chip Services Wire Bond Services (SCA) Production Capabilities Burn-In Services Assembly Processes RFQ Sheet Assembly Flow Test Services Plating Services

Home > Services > Wire Bond Services (SCA) > Assembly Processes Wire Bond Services (SCA) Assembly Processes Die Attach: Epoxy/Silver glass Wire Bond: Al Wedge/Au Ball/Au Wedge Sealing: AuSn/Eutectic/Glass/Epoxy Lead Finishing: Solder dipping on gold plated leads Marking Environmental Testing: Temperature Cycle/Centrifuge/PIND Hermeticity Testing: Fine/Gross Leak External Heatsinks/Capacitors Attach Lead Trimming/Forming  Related link

Home > Services > Wire Bond Services (SCA) > Assembly Processes Page Top

Contact     Terms of use     Privacy     Sitemap