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Wire Bond Packaging (SCA)
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Home > Services > Wire Bond Packaging (SCA) > Production Capabilities
Wire Bond Packaging (SCA)
Production Capabilities

  • ISO 9001/14001 Registered
  • Class B and S Assembly
  • Commercial Assembly
  • Quick Turn/Prototype Assembly
  • Traceability
  • CPGA
  • CQFP
  • Image Devices
    (CCD, CMOS, Sensor)
  • GaAs Device
  • DBGA/BGA
  • Plastic Premold Packages
  • Cerquad
  • PPGA/PBGA/PLGA
  • CSP

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