- Contract Assembly
- Flip Chip
- Hermetic Package Assembly
- Image Sensor
- Thermal Management Solutions
- Solder Ball Attach
- Vacuum Solder
- Wirebond
- Plating
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Hermetic Package Assembly
- Production / Prototype builds
- Seam Seal process
- Kovar seal ring and Kovar lid
- Au surface seal ring and AuSn preform lid
