Semiconductor Parts » Chemical Products » Epoxies

Epoxy Molding Compounds for Semiconductors

Molding Compounds

Kyocera Chemical’s Epoxy Molding Compounds (EMCs) are widely used across many industries due to the advanced technology we have cultivated over many years.

In order to help our customers achieve lead-free packaging technology and highly reliable performance in high-temperature applications, we have developed environmentally-friendly products across all EMC grades by employing non-halogen technology.

Epoxy Encapsulation Materials for Semiconductors
Package list 1

 QFPQFNSOPDIPSIP
ZIP*
DiscreteModule
 LargeSmallThin LargeThickSmallThinSmallPowerSMDPhoto-
Coup.
PowerGeneral
KE-96
White
                           
KE-200        
KE-300                
KE-320            
KE-500                        
KE-850
High Thermal
Cconductivity
                       
KE-1000                  
KE-G300                    
KE-G3000              
KE-G5000                

☆: ideal application ○: available application
*ZIP = Zigzag Inline Package
All grades are Br/Sb free

Epoxy Encapsulation Materials for Semiconductors
Package List 2

 P-BGAF-BGAModule
 SingleMAP*Flip ChipMAP*Flip ChipPowerGeneral
KE-G1250AH
Compression Molding
   
KE-G1250DS          
KE-G1250FC          
KE-G1250LKDS          
KE-G1250TC          
KE-G1250SK          
KE-G1250HT
High Thermal Conductivity
       
KE-G1270          

☆: ideal application ○: available application
*MAP = Mold Array Package
All grades are Br/Sb free


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