THE NEW VALUE FRONTIER
Privacy Policy & Notice to California Residents
Semiconductor Components » Packaging
  • Contact Us Today!

    If you have any questions about packaging technology or would like to discuss your requirements regardless of where you are in the design cycle or procurement phase, please click on the link above.

  • Follow us on LinkedIn!

    LinkedIn

Packaging

The role of device packaging is more critical than it was in the beginning of microelectronics. Back when 500 MHz signals were considered state-of-the art and silicon was the only semiconductor material commercially available, the impact of package design and materials on circuit performance was not as significant as it is now. Kyocera International's advances in package manufacturing technology, new materials, and software design and simulation tools helped our customers to achieve the benefit of greater degrees of freedom for device and circuit design and most importantly, helped our customers be the impetus for growth in the microelectronics industry. Today and for the foreseeable future, device performance is typically limited by the package or circuit board performance. Semiconductor packaging must now accommodate frequencies approaching 100 GHz, withstand adverse environmental conditions, and provide thermal relief for high-power GaN and SiC devices. At Kyocera International, we provide custom and off-the-shelf packaging options in ceramic and organic material sets. Our 40+ years of manufacturing experience gives our customers semiconductor packaging solutions for optimal thermo-mechanical and electrical circuit performance.


Click here to see enlarged image of Design Process

Design Cycle