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BGA Packages
Kyocera offers a wide variety of Ball Grid Arrays (BGAs) ranging from C-BGAs and Kyocera's original high-reliability Dimpled BGAs (D-BGA), to HITCE BGAs with customizable thermal expansion. BGA packages are well-suited for high frequency applications and where increasing functional integration requires high-density routing and a large number of I/Os in a smaller footprint.
- Shorter interconnection lengths provides improved signal integrity for high speed or high frequency designs
- Provides electrical designers with advantages for power and ground distribution on the die
- Overcomes wirebond pad pitch limitations
- Parallel bonding process - All joints formed simultaneously
Flip chip and wire bonding options are available and have been engineered for numerous high-reliability applications including image sensors, satellite communications, high-performance telecommunications, and workstation servers.