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System-in-Package (SiP)

Also known as Multichip Modules (MCMs), Kyocera America offers a variety of ceramic materials for MCM-C and SiP applications. SiP modules are available in LTCC, MTCC, or HTCC. Other material sets are available upon special request. These ceramics, along with alumina, are fired at high temperatures and require refractory metallization systems, such as tungsten and molybdenum metals.

Also available are ceramics that fire at temperatures under 1,000° C. Low Temperature Co-fired Ceramic (LTCC) is composed primarily of borosilicate glass systems with gold or silver metallization. MTCC is a new ceramic package material system utilizing copper metallization for low-resistance traces. These glass-ceramic MCM-C materials exhibit excellent electrical conductivity properties for high-speed transmission lines and favorable dielectric properties for greatly reduced propagation delays.

Semiparts System in Package


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