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AUTOMOTIVE
Kyocera offers multilayer ceramic substrates incorporating copper thick
film circuitry on exterior layers for ECU applications requiring durability and
high value. Blind vias and metal filled channel technology offer a compact,
highly reliable monolithic circuit board allowing power and logic integration on
a single thermally durable substrate. These substrates can be mounted directly
onto engines and power train systems and are currently in volume production.
For additional product information click here.
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