| Materials: |
Substrates/Piece parts: |
190 and 170 W/mK
Tape process, dry pressing
As-fired, lapped, annealed, lasered |
| |
Multilayer: |
170 and 150 W/mK
Tape cast |
|
| Technology: |
Metallization: |
Thin film conductors
W: vias and buried (multilayer) |
| |
Lead Frame: |
Kovar, Alloy 42 |
| |
Flange: |
Cu, CuMoCu (CMC, "1:1:1") |
| |
Brazing: |
Cusil, Au/Ge, Au/Sn, Incusil |
| |
Plating: |
Ni, Au |
|
| Package Styles: |
SO-8: |
F0127: thin film, leadless
F0130: dual die version |
| |
Microwave: |
A717 (MLP-600):
Thin film, CMC flange, 2GHz |
| |
RF: |
A916 (500CQ):
Thin film, Cu flange |
| |
LDMOS: |
CMC flange, AlN window frame |
| |
Custom: |
Design and production capability |
|
| Kyocera Japan: |
Low cost: |
75 W/mK, Reduced temperature cofired |
|
| Future: |
Resistors/Terminations: |
High power, flanged
Surface mount, flangeless |
|
| Contacts: |
Ralph Gonzalez: |
(858) 614-2538 |
| |
Arne Knudsen: |
(858) 576-2751
(858) 576-7003 (fax) |
