BGA
Kyocera offers a wide variety of Ball Grid Arrays (BGAs) ranging from C-BGAs and Kyocera's original Dimpled BGAs (D-BGA), to HITCE BGAs which comply with various customer requirements. Flip chip and wire bonding options are available and have been adopted for applications including high reliability, satellite communications, high performance telecommunications, and workstation servers.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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