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- Local Engineering Service
- Quick Turn Prototyping
- Value Chain Available
Kyocera offers complete flip chip packaging capabilities within our San Diego, California manufacturing plant. This state-of-the-art facility specializes in high-quality, high-yield assembly of a wide variety of packages.
Complementing our assembly capabilities are value added test services, utilizing advanced equipment and technology. The results are a reliable, total turnkey flip chip packaging solution.
Advanced assembly equipment combined with Kyocera's years of experience in packaging produces a world-class package manufacturing solution.
Visit our Technical Library for an article on Flip Chip Challenges
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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