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Kyocera Semiconductor Capabilitites (35K 07/22/02)
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Standard Surface Mount Packages (120K 10/06/98)
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Standard SO-8 Packages (81.2K 10/06/98)
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LDMOS Packages (108K 10/06/98)
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Standard RF Packages (119K 10/06/98)
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Standard Microwave Packages (703K 07/01/99)
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High Frequency MMIC/MCM Packages (925K 07/01/99)
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Ceramic Eyelet Power Packages (1.09M 07/01/99)
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Standard Metalized Ceramics (184K 12/17/99)
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TECHNICAL PAPER TITLE
|
CONFERENCE
|
DATE
|
| Miniature, Broadband Bandpass Filters Using
Double-Layered Coupled Stripline Resonators (1.53MB) |
IEEE Microwave Symposium6
San Francisco, CA |
June 13-15, 2006
|
| Full-wave Analysis and Characterization of Via Grounding Techniques Used
To Isolate Striplines For Embedded Passive Interconnects (266KB) |
CICMT 2006
Denver, Colorado |
4/2006
|
A Propensity for Density (119KB)
(First published in Advancing Microelectronics, March/April 2000.) |
N/A |
5/4/00
|
Flip Chip Challenges (27KB)
(First published in HDI Magazine, February 2000) |
N/A |
3/6/00
|
| Integrated Passive Components: A Brief Overview of LTCC Surface Mount and Integral Options (336KB) |
N/A |
9/1/99
|
| Development of Millimeterwave Package for W-Band |
28th European Microwave Conference |
10/7/98
|
| Development of a Package Utilizing an Electromagnetic Coupling Structure |
IEEE MTT-S |
6/10/98
|
| Development of Millimeterwave Package |
1998 Asia Pacific Microwave Conference |
12/8/98
|
| A Functional Power Amplifier Module with Integrated Passives |
Advanced Technology Workshop on Integrated Passives Technology |
4/17/98 - 4/19/98
|
| Ceramic CSP — Current Status of Technology |
8th Annual Surface Mount Int'l Conference |
8/27/98
|
| Ceramic CSP — The Characteristics and the Advantages |
31st IMAPS |
11/4/98
|
| Development of Array Format Ceramic CSP |
4th Annual Pan Pacific Microelectronics Symposium |
2/3/99
|
| CSP — The Ceramic Renaissance |
Yoshinobu Kunitomo Electronics Jissou Gijutsu Special Issue 1998 |
1998
|
| Ceramic CSP — Options for a Low-Cost, High-Density Technology — Comparison with the Plastic CSP |
Dr. M. Terasawa Nikkei Microdevices June 1988 Edition |
5/13/97
|
| Improvement of Solder Joint Reliability Between Multilayer Ceramic Package and Printed Wiring Board by New Ceramic Material |
47th ECTC |
4/27/98 - 4/29/98
|
| Multilayer Alumina Substrates for ECU IEMT Europe 98 |
ECU IEMT Europe 98 |
|
| New Design Concept of Alumina Ceramic Substrate for Future ECU |
SAE99 |
3/3/99
|
| Alumina Substrate Developed for Flip-Chip Mount ECU |
SAE99 |
3/3/99
|
| 2nd Level Interconnect Reliabilty of Ceramic Area Array Packages |
Semicon Taiwan97 |
9/23/97
|
| Aluminum Nitride Packaging |
Advanced Packaging Materials Conference |
3/16/99
|
| Thin Film Built-in L.C.R. Module for High Frequency Application |
ISHM/Venice |
5/14/97
|
| LSI Packaging Technology |
IPSS |
12/2/97
|
| The Possibility of High Frequency Functional Ceramics Substrate |
International Symposium on Multilayer Electronic Ceramic Devices |
5/3/98
|
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