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Press Releases
October 12, 2005
Kyocera Receives Supplier Recognition Award From Raytheon
August 18, 2005
Kyocera Receives Supplier of the Year and Gold Performance Excellence Award from Freescale Semiconductor
August 17, 2005
Kyocera Announces Subcontract Plating Services
April 07, 2005
Kyocera Announces New 28-Lead QLFP Package for Millimeter-wave Frequencies
February 22, 2005
KYOCERA Expands Flip Chip Assembly
February 22, 2005
KYOCERA Receives DSCC Certification
June 21, 2004
KYOCERA Delivers Brazed, Lower Cost LDMOS With Improved Theta JC Using AuSi Die Attach Process
May 20, 2004
Coventor And Kyocera Deliver Standard Package Libraries For MEMS Enabled Products
June 01, 2002
Kyocera Develops an Alumina Multilayer Package With Low Resistance Routing Patterns
October 09, 2001
Kyocera Introduces Next Generation Flip Chip Build-Up Packages
September 24, 2001
Kyocera Flip Chip Build-Up Packages Pass 260°C
August 27, 2001
Kyocera Receives Supplier Excellence Award from Texas Instruments
January 14, 2000
Kyocera America, Inc. Purchases VisPro Corporation
November 10, 1999
Kyocera America, Inc. Flip Chip Line Passes Process Qualification Testing
October 05, 1999
Kyocera Signs Cooperative Subcontracting Agreement with Unitive Electronics, Inc.
September 09, 1999
Kyocera and ISE Labs Enter Into Strategic Alliance for IC Testing and Assembly Services
May 11, 1999
Kyocera Announces High Frequency Surface Mount Package
May 03, 1999
Kyocera America, Inc. Enters Plastic Packaging Assembly Arena
September 11, 1998
Kyocera Announces New Low-Resistance TO-25X Eyelet Packages for Power Controllers and Power Rectifiers
August 20, 1998
JOHN SCHIERER Joins Kyocera America, Inc. as Manager of Human Resources
Back to press releases
Editorial Contact: Iris Labadie
Phone: (858) 614-2592
E-mail: Iris.Labadie@kyocera.com
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