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AUTOMOTIVE ECU
The Size and intelligence to get out of the dash
and go under the hood.
When the world's leading source for cost-effective ceramic packaging solutions designed its new ECU substrate, it changed the way automotive engineers think.
Kyocera's small, high-temperature co-fired ceramic substrates reduce housing sizes - not performance. Our reliable ceramic interconnect solutions can withstand the demands of extreme under-hood environments. This means you can integrate your ECU on the engine or virtually anywhere along the powertrain.
Additional benefits include:
- .1mm Line and Space Tolerance
- Thick Film Copper Conductors and Resistors
- Integrates Power and Signal Circuitry
- Internal High Current Line 10-50 Amps
- Straight, Stackable and Blind Via Holes
- Suitable for Flip Chip, Wirebond or Direct Chip Attachment
- High Flexural Strength and Thermal Conductivity
All Kyocera ECU substrates reflect years of automotive engineering know-how and exhibit the reliability and unequalled manufacturing expertise designers have com to expect from Kyocera- The World Leader in Eletronic Packaging Solutions.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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