Skip to main content Kyocera the Americas THE NEW VALUE FRONTIER
Global      U.S.A.      Semiconductor Parts
Home      About      Products      Applications      Technology      Assembly Services      Plating Services      Extranet     
Products
ALN
Assembly Services
Automotive ECU
BGA
CQFP
Dupont Material
Eyelet Power Packages
Ferro Material
Flip Chip Packaging
HITCE
LCC
LDMOS
Lids
LTCC
LTCC Division
MCM
Metallized Substrates
Millimeter Wave Packaging
MMIC Packages
Optoelectronic Components
Organic
PGA
Plating Services
Power Transistor Packages
SMD
T/R Modules
Thin Film

Home > Products > Leadless Chip Carriers
Products
LCC

LCC Products Kyocera's Multilayer Division utilizes the most state-of-the-art equipment, combined with a knowledgeable technical staff, to create high-quality, durable leadless chip carriers (LCC). The LCC package is preferred where requirements call out for a low-profile package or a surface mountable, solderable package with low inductance to be used in various commercial applications.


To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.


 

Home > Products > LCC Page Top 
Contact Us     Terms of use     Privacy     Sitemap     Copyright 2009 KYOCERA International, Inc., all rights reserved.