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MMIC PACKAGES
As the operating frequency of a die increases, the package parasitics become an ever increasing component to the system performance. To minimize these effects, the package design and characteristic impedence needs to be designed very carefully, keeping in mind the mechanical requirements along with the electrical requirements. We have many years of experience in designing these types of packages at Kyocera, and we also have the latest in 3D HFSS simulation and a network analyser (HP8510C - 50 GHz signal source) to optimize either our own or our customer's designs. Several open-tooled parts and feed-thoughs exist for more rapid lead times.
High temperature Ag/Cu braze is typically used; but Ag/Cu/In and Au brazes, such as Au/Ge and Au/Sn, may also be used where lower temperature brazing is needed. This may be to reduce brazing stresses or because other materials in the package require lower temperatures. Flange materials may be ASTM F-15, W/Cu, Mo/Cu, or even AlSiC. For some examples of typical MMIC package structures, see the High Frequency MMIC / MCM Package - Product Information Sheet*.
Applications of MMIC packages primarily include hi-reliability. Other applications include info processing and telecommunications.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
*NOTE: In order to view this link, you will need Adobe Acrobat Reader. Download Adobe's Acrobat Reader.
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