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Electroless Gold
Kyocera specializes in soft, pure gold for microelectronic applications. The electroless gold has excellent wire bondability, solderability, and eutectic die attach properties.
The electroless gold plating process currently in use is designed for use with an electroless nickel-phosphorous undercoat. It utilizes an immersion gold step to deposit a thin, adherent layer onto the nickel surface. The gold plating step uses an autocatalytic solution which will plate gold to any required thickness.
Parts can be plated using plastic fixtures, racks or barrels.
Some examples of parts plated with electroless gold include:
- Ceramic MCMs
- Metallized capacitors/inductors
- Metallized lids
- Ceramic substrates
- Glass ceramic substrates
Our line processes parts up to 4"x4" and weighing up to 20 pounds. Very small parts may be plated using barrel plating.
Thickness measurements are made using a Seiko XRF 7000 with NIST traceable standards. We are also capable of performing all MIL-STD-883 functional tests.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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