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Electroless Nickel
Nickel is often used in the microelectronics industry as a diffusion barrier between base metallization (such as copper) and the final gold overplate. Electroless plating is used on parts which have electrically isolated pads or pins, where electrolytic plating cannot be used. There are two options available for electroless nickel plating:
- Phosphorous nickel is used whenever a thick gold overplate is required. Kyocera uses a mid- to high-phosphorous nickel system which contains 8-11% phosphorous in the plated layer. The parts can then be further plated with electroless gold (see Electroless Gold page).
- Boron nickel is used when high-temperature braze is to be used in a subsequent process, or if very high solderability is required. The boron content is <1%, giving a very high nickel content compared to phosphorous nickel.
The electroless nickel plating process is autocatalytic on nickel, kovar, steel or similar metals. A palladium activator is used to plate onto copper, silver, tungsten or most other metals.
Our line processes parts up to 12"x12" and weighing up to 20 pounds. Very small parts may be plated using barrel plating.
Thickness measurements are made using a Seiko XRF 7000 with NIST traceable standards. We are also capable of performing all MIL-STD-883 functional tests.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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