Skip to main content Kyocera the Americas THE NEW VALUE FRONTIER
Global      U.S.A.      Semiconductor Parts
Home      About      Products      Applications      Technology      Services      Extranet     
Services
Flip Chip Packaging
Wire Bond Packaging (SCA)
Plating Services
Home > Services
Services
Computer Chips Kyocera's assembly division is a complete solutions provider, supporting assembly and test needs from package development through final test and burn-in.

From our world-class manufacturing facility in San Diego, California, we deliver reduced cycle times, an extensive package portfolio and the quality assurance that you can expect from a fully ISO-9001 and 14001 registered manufacturer.

Complementing assembly are value-added test services offered through our alliance partners. These partners utilize advanced equipment and technology to provide total turnkey IC packaging services. Whether your needs include cutting - edge package designs, industry leading assembly services or test capabilities, Kyocera provides your company with reliable, cost conscious solutions.

Kyocera also provides state-of-the-art nickel, gold, copper and tin-lead plating services to meet the needs of our broad customer base. We offer quick turnaround, expert engineering support, and a wide range of functional test capabilities. Kyocera can fulfill your requirements for plating services.

Kyocera enjoys a history of innovation and aggresive service with more than a decade of experience, satisfying some of the largest - and most demanding - customers in the industry.


To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.


 Related link
 
Home > Services Page Top 
Contact     Terms of use     Privacy     Sitemap     Copyright KYOCERA International, Inc., all rights reserved.