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Tin-Lead
Tin-Lead is used to prepare a solderable part without using gold. Typically an undercoating of electrolytic nickel is applied, followed by several hundred micro-inches of eutectic solder.
Typical applications of tin-lead plating include:
- Dual in-line packages
- Ceramic PGAs
- Ceramic substrates
Thickness measurements are made using a Seiko XRF 7000 with NIST traceable standards. We are also capable of performing all MIL-STD-883 functional tests.
To contact us for specific product information or to get a quote, please click here or call us at 800-468-2957 for more information.
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