Global      U.S.A.      Semiconductor Parts

Home      About      Products      Applications      Technology      Services      Extranet

Services Flip Chip Packaging Wire Bond Packaging (SCA) Production Capabilities Burn-In Services Assembly Processes RFQ Sheet Assembly Flow Test Services Plating Services

Home > Services > Wire Bond Packaging (SCA) > Assembly Processes Assembly Processes Die Attach: Epoxy/Silver glass Wire Bond: Al Wedge/Au Ball/Au Wedge Sealing: AuSn/Eutectic/Glass/Epoxy Lead Finishing: Solder dipping on gold plated leads Marking Environmental Testing: Temperature Cycle/Centrifuge/PIND Hermeticity Testing: Fine/Gross Leak External Heatsinks/Capacitors Attach Lead Trimming/Forming  Related link

Home > Services > Wire Bond Packaging (SCA) > Assembly Processes Page Top

Contact     Terms of use     Privacy     Sitemap