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Process Step
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Process Detail
and Options
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Specification
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1.
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Incoming Wafer
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Recieve material from customer
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2.
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Incoming QA
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AQL 1% II
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KS-1001
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3.
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Mount Wafer on Tape
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KS-1001
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4.
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Dicing
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Options:
a. DI water
b. DI water w/ CO²
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KS-1001
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5.
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Die Pik
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Pik GED from wafer and load into wafer tray
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KS-1001
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6.
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Visual Inspection
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100% inspection
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KS-1001
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7.
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QC Gate
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AQL 1% II
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KS-1001
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8.
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Incoming Package
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9.
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Incoming Die Bond Material
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10.
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Die Attach
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Material options:
- Silver-filled organic adhesive
- Silver Glass
Process options:
- Automatic Process
- Semi-automatic
- Manual
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KS-1001
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11.
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Adhesive Cure
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Options:
a. Constant temp oven cure
b. Multiple temp steps oven cure
c. Furnace cure
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KS-1001
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12.
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Die Attach Quality Monitor
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Options:
a. Stud-pull test
b. Die shear test
c. X-ray
d. Sonoscan
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KS-1001
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13.
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Incoming Wire
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14.
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Wire Bond
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Options:
- Au Wire
0.7mil - 65 micron bond pitch
1 mil - 75 micron bond pitch
1.3 mil - 90 Micron bond pitch
- Al Wire
0.7 mil - 65 micron bond pitch
1 mil - 75 micron bond pitch
1.25 mil - 85 mil bond pitch
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KS-1001
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15.
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Wire Bond Quality Monitor
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Options:
a. Wire pull test
b. Ball shear test
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KS-1001
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16.
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Visual Inspection
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100% inspection
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KS-1001
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17.
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QC Gate
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AQL 1% II
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KS-1001
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18.
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Incoming Lid
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19.
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Capping
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Options:
a. Ceramic lid w/ adhesive
b. Ceramic lid w/ solder
c. Ceramic lid w/ glass frit
d. Combo lid w/ AuSn solder
e. Glass lid w/ adhesive
f. Glob top encapsulation w/ epxoy
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KS-1001
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20.
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Sealing
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Options:
a. Furnace cure
b. Constant temp oven cure
c. Multiple temp steps oven cure
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KS-1001
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21.
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Marking
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Options:
a. Pad marking vs. Offset marking
b. Black ink vs. white ink
c. Serialization
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KS-1001
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22.
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Cure
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KS-1001
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23.
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Leak Test
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Options:
a. Fine leak test
b. Gross leak test
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KS-1001
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24.
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Visual Inspection
|
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100% inspection
|
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KS-1001
|
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25.
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QC Gate
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AQL 1% II
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26.
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Packing
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KS-1001
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27.
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Shipping
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KS-1001
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