 |
|
Process Step
|
|
Process Detail
and Options
|
|
Specification
|
|
|
 |
1.
|
Incoming Wafer
|
|
Recieve material from customer
|
|
|
|
|
|
|
|
|
|
 |
2.
|
Incoming QA
|
|
AQL 1% II
|
|
KS-1001
|
|
|
|
|
|
|
|
 |
3.
|
Mount Wafer on Tape
|
|
|
|
KS-1001
|
|
|
|
|
|
|
|
|
4.
|
Dicing
|
|
Options:
a. DI water
b. DI water w/ CO²
|
|
KS-1001
|
|
|
|
|
|
|
|
|
5.
|
Die Pik
|
|
Pik GED from wafer and load into wafer tray
|
|
KS-1001
|
|
|
|
|
|
|
|
|
6.
|
Visual Inspection
|
|
100% inspection
|
|
KS-1001
|
|
|
|
|
|
|
|
|
7.
|
QC Gate
|
|
AQL 1% II
|
|
KS-1001
|
|
|
|
|
|
|
|
 |
8.
|
Incoming Chip Capacitor
|
|
|
|
|
|
|
|
|
|
|
|
|
9.
|
Incoming Solder Paste
|
|
63% Sn-37% Pb
|
|
|
|
|
|
|
|
|
|
|
10.
|
Incoming Package
|
|
|
|
|
|
|
|
|
|
|
|
|
11.
|
Chip Capacitor Attachment
|
|
Options:
a. Manual
b. Automatic
|
|
KS-1001
|
|
|
|
|
|
|
|
|
12.
|
Reflow
|
|
|
|
KS-1001
|
|
|
|
|
|
|
|
|
13.
|
Flux Cleaning
|
|
DI water w/ cleaner
|
|
|
|
|
|
|
|
|
|
|
14.
|
Incoming Die Attach Material
|
|
|
|
|
|
|
|
|
|
|
|
|
15.
|
Die Attach
|
|
Material: Silver-filled organic adhesive
Process options:
a. Automatic process
b. Semi-automatic
c. Manual
|
|
KS-1001
|
|
|
|
|
|
|
|
|
16.
|
Adhesive Cure
|
|
Options:
a. Constant temp oven cure
b. Multiple temp steps oven cure
|
|
KS-1001
|
|
|
|
|
|
|
|
|
17.
|
Die Attach Quality Monitor
|
|
Options:
a. Stud-pull test
b. Die shear test
c. X-ray
d. Sonoscan
|
|
KS-1001
|
|
|
|
|
|
|
|
|
18.
|
Plasma Cleaning
|
|
Options:
a. Ar
b. Ar + O²
|
|
|
|
|
|
|
|
|
|
|
19.
|
Incoming Wire
|
|
|
|
|
|
|
|
|
|
|
|
|
20.
|
Wire Bond
|
|
Options:
- Au wire
0.7 mil - 65 micron bond pitch
1 mil - 75 micron bond pitch
1.3 mil - 90 micron bond pitch
- Al wire
0.7 mil - 65 micron bond pitch
1 mil - 75 micron bond pitch
1.25 mil - 85 mil bond pitch
|
|
KS-1001
|
|
|
|
|
|
|
|
|
21.
|
Wire Bond Quality Monitor
|
|
Options:
a. Wire pull test
b. Ball shear test
|
|
KS-1001
|
|
|
|
|
|
|
|
|
22.
|
Visual Inspection
|
|
100% inspection
|
|
KS-1001
|
|
|
|
|
|
|
|
|
23.
|
QC Gate
|
|
AQL 1% II
|
|
KS-1001
|
|
|
|
|
|
|
|
|
24.
|
Incoming Encapsulation
|
|
For Fill - Hysol 4450 HF
For Dam - Hysol 4451
|
|
|
|
|
|
|
|
|
|
|
25.
|
Plasma Cleaning
|
|
Optional
|
|
|
|
|
|
|
|
|
|
|
26.
|
Encapsulation
|
|
Options:
a. Cavity Fill
b. Dam-and-fill
|
|
KS-1001
|
|
|
|
|
|
|
|
|
27.
|
Cure
|
|
Options:
a. Constant temp oven cure
b. Multiple temp steps oven cure
|
|
KS-1001
|
|
|
|
|
|
|
|
|
28.
|
Visual Inspection
|
|
|
|
KS-1001
|
|
|
|
|
|
|
|
|
29.
|
Marking
|
|
Options:
a. Offset marking
b. White ink
c. Serialization
|
|
KS-1001
|
|
|
|
|
|
|
|
|
30.
|
Cure
|
|
|
|
KS-1001
|
|
|
|
|
|
|
|
|
31.
|
Flux Transfer
|
|
|
|
|
|
|
|
|
|
|
|
|
32.
|
Incoming Solder Ball
|
|
|
|
|
|
|
|
|
|
|
|
|
33.
|
Ball Attachment
|
|
|
|
|
|
|
|
|
|
|
|
|
34.
|
Flux Cleaning
|
|
|
|
|
|
|
|
|
|
|
|
|
35.
|
Ball Shear Test
|
|
|
|
|
|
|
|
|
|
|
|
|
36.
|
Visual Inspection
|
|
100% insepction
|
|
KS-1001
|
|
|
|
|
|
|
|
|
37.
|
Co-planarity Check
|
|
|
|
|
|
|
|
|
|
|
|
|
38.
|
QC Gate
|
|
AQL 1% II
|
|
KS-1001
|
|
|
|
|
|
|
|
|
39.
|
Packing
|
|
|
|
KS-1001
|
|
|
|
|
|
|
|
 |
40.
|
Shipping
|
|
|
|
KS-1001
|
Page Top