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Home > Products > Semiconductor Processing Equipment > Assembly Technology
Semiconductor Processing Equipment
Kyocera Industrial Ceramics Corporation has the capability to link an abundance of technological resources. The Kyocera Group is comprised of a diversified technology network consisting of advanced ceramic materials, components, optics, devices, consumer products and services. We can vertically integrate one or more of our technologies to better serve your assembly or sub-assembly requirements.

Typical methods of joining advanced ceramic components to other materials are mechanical assembly, shrink fitting, epoxy bonding, metallizing and brazing, resin molding and metal casting.

Mechanical Assembly Metallizing / Brazing
Epoxy Bonding Shrink Fitting
 
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