Global      U.S.A.      Industrial Ceramics

Home      About      Products      News      Sales Offices      Careers      Contact

Products Industrial Ceramic Products Semiconductor Processing Equipment Products Wafer-making Wafer Processing Ultrasonic X-Y Stage Assembly Technology Types of Ceramics Production Process Tolerance Guideline Material Characteristics Brochures Automotive Ceramic Products Ultra-High Vacuum Ceramic-to-Metal Products Cutting Tool Products Liquid Crystal Display Products Thermal Printhead Products Lens and Lens Assembly Products Chemical

Home > Products > Semiconductor Processing Equipment > Wafer-making Wafer-Making Products WAFER POLISHING PLATE, TURN TABLE AND CONDITIONING RING Material: 99.5% Alumina Size Availability: 12" to 35" in diameter Features: Surface Flatness: < 1 - 2 microns High Rigidity Excellent Wear Resistance Excellent Flatness Retention Compared to Metal SiC POLISHING PLATE FOR SINGLE WAFER PROCESSING Material: Silicon Carbide Size Availability: 12" in diameter Profile Availability: Concave, Flat and Convex Features: Surface Flatness: < 1 micron High Thermal Conductivity Low Thermal Expansion High Rigidity Excellent Wear Resistance The Best Flatness Retention Compared to Metal

Home > Products > Semiconductor Processing Equipment > Wafer-making Page Top

Search     Sitemap