Kyocera Flip Chip Build-Up Packages Pass 260°C
San Diego, CA: September 24, 2001. Kyocera introduced today the industry's first flip chip build-up substrate capable of withstanding 260°C solder reflow necessary for lead (Pb) free processing. The High Density Build Up® (HDBU®) package has been qualified by multiple IC suppliers and assembly subcontractors, and is in volume production today. Kyocera's semi-additive build-up process provides the densities needed for high pin count flip chip products; commercial products are available in 200m flip chip bump pitches, with 25m lines, 27m spaces and 50m laser vias.
"The industry is currently requiring a lead-free solder solution, however most build-up packages can't withstand the necessary 260°C reflow," said Mr. Fritz Johnson, Organic Sales Manager for Kyocera's Microelectronic Packaging Division. "Kyocera anticipated the need for a lead-free solder solution on build-up packages and our flip chip build-up substrate is the first in the industry."
To verify that Kyocera's HDBU® substrates are compatible with lead (Pb) free processing, which often requires higher reflow temperatures, the packages were preconditioned at JEDEC Level 3 (30°C / 60% RH, 192 hours) then passed through 260° reflow profile a total of three passes. The substrates were confirmed to have no blisters, voids or delamination; no electrical opens or shorts; and no increase in trace resistance. The test package used was a 1280 BGA with 40mm body size and 3 build up layers on each side of the core (3/2/3 construction.)
Kyocera's next step will be to work with customers to test the performance of various qualified underfill materials and die mounting processes to confirm the performance of fully assembled packages under 260°C solder reflow conditions.
Kyocera's HDBU® substrates for flip chip packaging are manufactured at Kyocera Corporation's Sendai and Kokubu factories in Kagoshima, Japan. North American customers are supported by Kyocera America Inc., with sales offices and design centers throughout the United States.
San Diego-based Kyocera America, Inc. designs, manufactures and assembles a broad range of electronic packaging solutions for the telecommunications and semiconductor markets based on advanced ceramic and plastic material technologies. The company's package products and services support many applications including broadband telecommunications, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers and consumer electronic goods.
Kyocera America, Inc. has manufacturing facilities in California and Oregon, with sales offices and design centers throughout the United States. The company is a wholly-owned subsidiary of Kyocera International, Inc. of San Diego, the North American headquarters and holding company for Kyoto, Japan-based Kyocera Corporation (NYSE:KYO).
Kyocera Corporation, the group's global parent, employs 40,000 people in 25 nations and recorded consolidated sales of $1.285 trillion yen (US $10.2 billion) during the year ended March 31, 2001.