News » 2001 » Kyocera Introduces Next Generation Flip Chip Build-Up Packages


Kyocera Introduces Next Generation Flip Chip Build-Up Packages

San Diego, CA: October 9, 2001. Kyocera will introduce the next generation organic substrate for flip chip semiconductor packaging, S-HDBU(R) (Super High-Density Build Up), at the IMAPS show in Baltimore on October 9, 2001. This advancement allows superior signal routing of full array I/O's at flip chip bump pitch down to 180um with a roadmap to 150um pitch capability.

Most build up technologies available for flip chip packaging today are based on a laminate core technology using mechanically drilled through vias at 500 to 600um pitch, which makes routing of high signal count devices difficult. Kyocera's new high density core technology, called "single lamination curing," uses laser vias to reduce the through via pitch in the core to 250um for commercial production, and prototypes have already been produced at 220um pitch. The laser vias can be designed as stacked through vias, blind vias, and buried vias connecting any of the core layers. Copper conductor lines and space width in the core is reduced to 50/50um for commercial production, and prototypes have already been produced with 40/40um lines and spaces. These conductive layers are produced on a reel to reel process and copper foil transfer method, which allows automated optical inspection before lamination for improved yields and low cost.

When build up layers are laminated onto this new high-density organic laminate core, the resulting Super High-Density Build Up(R) package can achieve unparalleled routing capabilities among build up packages. Line and space widths of 25/27um in the build up layers allow 180um flip chip bump pitch available today with controlled impedance.

Initial customer qualifications on packages 45mm and larger are just finishing after passing industry standard reliability requirements along with Kyocera internal evaluation tests including 1,800 temperature cycles (package level tests, -55 deg C to 125 deg C) and 5,000+ temperature cycles (board level tests, 0 deg C to 100 deg C).

Kyocera's High-Density Build Up(R) and new Super High-Density Build Up(R) substrates for flip chip packaging are manufactured at Kyocera Corporation's Sendai and Kokubu factories in Kagoshima, Japan. North American customers are supported by Kyocera America, Inc., with sales offices and design centers throughout the United States.

San Diego-based Kyocera America, Inc. designs, manufactures and assembles a broad range of electronic packaging solutions for the telecommunications and semiconductor markets based on advanced ceramic and plastic material technologies. The company's package products and services support many applications including broadband telecommunications, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers and consumer electronic goods.

Kyocera America, Inc. has manufacturing facilities in California and Oregon, with sales offices and design centers throughout the United States. The company is a wholly-owned subsidiary of Kyocera International, Inc. of San Diego, the North American headquarters and holding company for Kyoto, Japan-based Kyocera Corporation (NYSE:KYO).

Kyocera Corporation, the group's global parent, employs 40,000 people in 25 nations and recorded consolidated sales of $1.285 trillion yen (US $10.2 billion) during the year ended March 31, 2001.