Coventor And Kyocera Deliver Standard Package Libraries For MEMS Enabled Products
New tools reduce MEMS packaging development time and costsCARY, N.C. (May 20, 2004) - Coventor Inc, the leader in MEMS design software, and Kyocera, the industry leader in IC and MEMS packaging solutions have teamed up to provide software libraries for Micro-Electro-Mechanical Systems (MEMS) applications. The package libraries, developed jointly by Coventor and Kyocera, will contain software models of a variety of MEMS compatible open tool hermetic ceramic packages, which are currently offered in Kyocera's product portfolio.
The package library design information will be made available at no charge to new and existing CoventorWare™ software customers.
The package library will initially target RF, inertial and infrared MEMS applications and will include elements such as package mask, process descriptions, material property data, and 3D detailed models. The libraries will initially enable users to couple MEMS devices and Kyocera standard packages for analysis of thermomechanical effects, low and high frequency coupled RLC effects, as well as, failure modes and design for reliability in the future.
In addition, coupled device/package macro model extraction is supported for Cadence and Synopsys environments which will provide users with the ability to include package stress effects at the system level thereby creating more robust designs.
The Standard package library contains models that include: SMD (surface mount device), S/B (side braze), PGA (pin grid array), C-DIP (Cerdip) and LCC (leadless chip carrier).
Due to the high-cost of packaging, which can be as much as 80% of the overall cost of MEMS development, advanced packaging tools for MEMS devices are crucial to cost-effective development. The availability of open tool standard package models directly in the designers CAD environment will shorten design times significantly by enabling more rapid package selection, tighter integration with the package development group, and result in increased system robustness through MEMS package co-design and simulation. This will lead to reduced time-to-market, thus drastically reducing overall costs.
Kyocera packaging libraries will be available with CoventorWare software in Q3 2004. For more information about CoventorWare and Kyocera MEMS packaging options, contact Coventor at 4001 Weston Parkway, Cary, NC, 27513, or call 919-854-7500 or visit www.coventor.com.
Coventor, Inc. headquartered in Cary, NC provides a comprehensive suite of software development tools targeting micro-electromechanical systems (MEMS), microfluidics and semiconductor process applications. CoventorWare is an industry standard platform adopted by most of the leading MEMS and microfluidics manufacturers around the globe, and by an extensive network of university partners. Coventor is a privately held company with offices in Cambridge, MA and San Mateo, CA. European headquarters is in Paris, France. Coventor also serves Asia Pacific through regional distributors. More information is available at www.coventor.com.
San Diego-based Kyocera America, Inc. designs, manufactures and assembles a broad range of electronic packaging solutions for the wireless, optoelectronic, semiconductor, telecommunications and specialty products market based on advanced ceramic and plastic material technologies. The company's products and services support broadband telecommunications, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers and consumer electronic goods.
Kyocera America, Inc. has manufacturing facilities in California and Oregon, with sales offices and design centers throughout the United States. The company is a wholly-owned subsidiary of Kyocera International, Inc. of San Diego, the North American headquarters and holding company for Kyoto, Japan-based Kyocera Corporation (NYSE:KYO).
Kyocera Corporation, the group's global parent, employs 40,000 people in 25 nations and recorded consolidated net sales of 1.14 trillion yen (US $10.9 billion) during the year ended March 31, 2002.