KYOCERA Expands Flip Chip Assembly
To offer 12-Inch Wafer Dicing Services
San Diego, CA: February 18, 2005 — Kyocera America, Inc. announced today that it has expanded its flip chip assembly operations to include 12-inch (300mm) wafer dicing. This new capability will increase Kyocera America's wafer dicing capacity by 30%, improving throughput times and yields after dicing.
“We have added a 12-inch wafer dicing machine to support increased semiconductor trend towards 300mm wafer production,” said Yasihiro Takai, General Manager, Assembly Technology Division. “It can be used on Si, SiGe and InP wafers, and will be especially helpful when working with semiconductor start-up companies that are going directly to 300mm technology.”
Kyocera worked very closely with Disco, the manufacturer of the machine, to develop a special wafer-cleaning feature.
The Assembly Technology Division of Kyocera America, Inc., located in San Diego, CA., offers state-of-the-art wirebond and flip chip turnkey assembly services for prototype, quick turn, as well as volume, commercial and defense-grade requirements. Besides being QML certified, Kyocera is ISO 9000-2000 and ISO 14,000 certified.
San Diego-based Kyocera America, Inc. designs, manufactures and assembles a broad range of electronic packaging solutions for the telecommunications and semiconductor markets based on advanced ceramic and plastic material technologies. Its products and services support broadband, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers and consumer electronics. The company has manufacturing facilities in San Diego, with sales offices and design centers throughout the United States. It is a wholly-owned subsidiary of Kyocera International, Inc. of San Diego, the North American headquarters and holding company for Kyoto, Japan-based Kyocera Corporation.
Kyocera Corporation (NYSE: KYO), the group's global parent, was founded in 1959 as a producer of advanced ceramics. By combining these engineered materials with metals and plastics, and integrating them with other technologies, Kyocera Corporation has become a leading supplier of semiconductor packages, telecommunications equipment, electronic components, solar energy systems, laser printers, copiers and industrial ceramics. Kyocera Corporation employs more than 50,000 people in 25 nations, and recorded consolidated net revenues of 1.14 trillion yen (US $11 billion) during the year ended March 31, 2004.