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Kyocera Industrial Ceramics Corporation to Introduce Ceramic-to-Metal Ultra High Vacuum Components at Semicon West 2003

Vancouver, WA – July 8, 2003 – Kyocera Industrial Ceramics Corporation (KICC) announced today the introduction of ceramic-to-metal ultra-high vacuum components (UHVC) to its broad product line.

Kyocera’s UHVC product line includes standard feedthroughs, connectors, flanges, plugs, sapphire windows, terminals, ceramic chambers, accelerator tubes and custom-made hermetically sealed metallized and brazed components.

Applications include medical, semiconductor processing, aerospace, particle physics, high voltage, high temperature, industrial processing and automotive.

Kyocera utilizes a variety of ceramic materials and metals with advanced sealing and brazing technologies to provide components of superior quality and performance. Ceramic materials include alumina from 90%-99.5% purity as well as single crystal sapphire.

KICC will feature UHV products along with our advanced ceramic semiconductor processing equipment components at Semicon West 2003 to be held July 14-16 in San Francisco, CA.

For additional information on KICC’s ceramic-to-metal technology, please contact:

Kyocera Industrial Ceramics Corporation
100 Industrial Park Road
Mountain Home, NC 28758
Phone: 828-693-0241
E-mail: industrial@kyocera.com
Web: www.kyocera.com/kicc

About Kyocera
Kyocera Industrial Ceramics Corporation is headquartered in Vancouver, WA with four manufacturing plants and 12 sales offices throughout the United States. The company manufactures advanced ceramic components and CERATIP cutting tools, and markets LCDs, thermal printheads, fiber optic components and industrial lenses. The company is a wholly-owned subsidiary of Kyocera International, Inc. of San Diego, the North American holding company for Kyocera Corporation.

Kyoto, Japan-based Kyocera Corporation (NYSE: KYO), the group’s global parent, employs approximately 40,000 people in 25 nations and recorded consolidated sales of $9.3 billion during the year ending March 31, 2003.


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