OFC 2022 Expo to Feature Kyocera’s Next-Generation, High-Speed Ceramic Packages for Optoelectronics

SAN DIEGO — Feb. 28, 2022 — Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC^®, the world’s largest optical fiber communication conference and exposition, March 8-10, at the San Diego Convention­­ Center. Click here or visit https://bit.ly/kyocera-fiberoptic for product details.

This year brings the first physical OFC conference since the onset of the COVID-19 pandemic. For over 40 years, OFC has provided a showcase to define new markets while introducing new technologies for the advancement of fiber-optic communication. OFC’s exhibition floor represents the global optical communications supply chain, from sub-components and components to devices, modules, systems, and test equipment.

Kyocera, the leading manufacturer of fiber-optic device packages, has contributed significantly to the technology’s evolution by pioneering high-speed electrical routing within multilayer-ceramic substrates. The company’s early milestones in optoelectronics involved supporting the original U.S. broadband build-out and the optical network onboard the International Space Station. Since then, Kyocera products have supported an historic increase of more than 5,000X in optical communication data speeds — from early 155Mbps technology to 800Gbps today.

OFC 2022 will spotlight new advances in enhanced high-speed packages that Kyocera has been developing continuously over the last two years, as well as new ceramic material solutions for the evolving and highly promising technology of silicon photonics.

Kyocera products on display at Booth #4728 will include:

High-Speed Ceramic Packages and Substrates

• HTCC (High-Temperature Co-fired Ceramic)
• LTCC (Low- Temperature Co-fired Ceramic)
  
  

Components for Silicon Photonics

• EML (Electro-absorption Modulated Laser) Carriers
• DML (Directly Modulated Laser) Carriers
• AlN (Aluminum Nitride) package/substrate material
  
  

New 128 Gbps (Gigabit-per-second) Series Packages

• CDM (Coherent Driver Modulator) HTCC Package
• ICR (Integrated Coherent Receiver) HTCC Package
• RF (Radio Frequency) Connector Package
• TROSA (Transmit/Receive Optical Sub-Assembly) LTCC Package w/Flip Chip & FPC interface
• TROSA HTCC Package
  
  

New Co-packaged Optics Product Line

• Low-CTE CPO (Co-Packaged Optics) Substrate
• OM (Optical Module) LTCC Substrate
• Large-Size, High-Density Ceramic Board
  
  

Standard Packages and Substrates

• Ceramic Hermetic Laser Packages
• Tunable / Pump Laser / SOA (Semiconductor Optical Amplifier) Packages
• QSFP (Quad Small-Form-factor Pluggable) 4-Channel AlN Substrate / 4-Channel HTCC Package
• Compact 1-Channel HTCC Package
• Cooled TO56 & TO60 Headers
• Uncooled TO56 & TO38 Headers
• Aluminum Nitride (AlN) Packages and Substrates
  
  

Other Fiber-Optic Products

• High-Power Laser Aluminum Nitride Submounts
• Ceramic Dispenser Nozzles
• Unique Zirconia Ferrules and Sleeves for Fiber-Optic Connectors
  
  

About KYOCERA

San Diego-based Kyocera International, Inc. is a wholly-owned subsidiary of Kyocera Corporation.

Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2021, the company’s consolidated sales revenue totaled 1.5 trillion yen (approx. US$13.8 billion). Kyocera is ranked #603 on Forbes magazine’s 2021 “Global 2000” list of the world’s largest publicly traded companies, and has appeared on The Wall Street Journal’s list of “The World’s 100 Most Sustainably Managed Companies.”

© 2022 Kyocera International, Inc.