Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions
10 April 2019
- Semiconductor Components & Assembly Services
Collaboration will maximize AI performance and minimize time-to-market for new processor designs
Andover, MA and Kyoto, Japan– April 10, 2019 – Kyocera Corporation (TOKYO:6971) and Vicor Corporation (NASDAQ:VICR) will collaborate on next-generation Power-on-Package solutions to maximize performance and minimize time-to-market for eme...