Semiconductor Components & Assembly Services
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Kyocera Corporation and SoftBank Corp. Succeeded in Demonstration of Backhaul System Utilizing 5G Millimeter-Wave
15 July 2022
- Corporate
- Semiconductor Components & Assembly Services
Read moreKYOCERA Corporation ("Kyocera") and SoftBank Corp. ("SoftBank") conducted a backhaul system verification test utilizing the millimeter-wave band allocated to SoftBank for 5G (referred to as "5G millimeter-wave") at SoftBank base stations located in A...
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OFC 2022 Expo to Feature Kyocera’s Next-Generation, High-Speed Ceramic Packages for Optoelectronics
28 February 2022
- Corporate
- Semiconductor Components & Assembly Services
Booth #4728 to showcase Kyocera packages and substrates supporting historic >5000X increase in optical data rates; March 8-10 in San Diego
Read moreSAN DIEGO — Feb. 28, 2022 — Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC®, the world’s largest optical fiber communication conference and exposition, M...
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SPIE Photonics West 2022 to Include Kyocera’s Ceramic Package and Optical Component Solutions
17 January 2022
- Corporate
- Lens Components
- Semiconductor Components & Assembly Services
Booth #4314 to feature Kyocera components enabling new advances in optoelectronics, Jan. 25-27, in San Francisco
Read moreSAN DIEGO — JAN.17, 2022 — Kyocera, the world leader in Fine Ceramics, will exhibit its latest optoelectronic products and technologies Jan. 25-27 at SPIE Photonics West 2022, Booth #4314, in San Francisco’s Moscone Center — showcasing components tha...
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Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions
10 April 2019
- Semiconductor Components & Assembly Services
Collaboration will maximize AI performance and minimize time-to-market for new processor designs
Read moreAndover, MA and Kyoto, Japan– April 10, 2019 – Kyocera Corporation (TOKYO:6971) and Vicor Corporation (NASDAQ:VICR) will collaborate on next-generation Power-on-Package solutions to maximize performance and minimize time-to-market for eme...