Semiconductor Components & Assembly Services
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Kyocera and Rohde & Schwarz to Demonstrate Over-the-Air Characterization of mmWave PAAM at IMS San Francisco, June 17-19, 2025
27 May 2025
- Corporate
- Semiconductor Components & Assembly Services
Read moreInside of the R&S ATS1800M test chamber showing OTA-characterization of Kyocera's PAAM. (Image: Kyocera) Kyocera has developed an innovative mmWave phased array antenna module (PAAM) that simultaneously creates multiple beams in different direc...
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SPIE Photonics West 2025 to Feature Kyocera’s Optical Components, Ceramic Package Solutions and Assembly Services
21 January 2025
- Corporate
- Semiconductor Components & Assembly Services
Visit Photonics West booth #4128 and AR/VR/MR booth #6204 to see Kyocera’s latest advances in optoelectronics, Jan. 28-30 in San Francisco
Read moreSAN DIEGO – JAN. 21, 2025 – Kyocera will exhibit its latest optoelectronic products and technologies at two upcoming events in San Francisco’s Moscone Center: SPIE Photonics West 2025, booth #4128, Jan. 28 to 30; and SPIE AR/VR/MR, booth #6204, Jan....
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SPIE Photonics West 2024 to Feature Kyocera’s Optical Components, Ceramic Package Solutions and Assembly Services
24 January 2024
- Corporate
- Semiconductor Components & Assembly Services
Booth #5529 and AR/VR/MR Booth #6303 to showcase Kyocera components enabling new advances in optoelectronics, Jan. 30 – Feb.1, in San Francisco
Read moreSAN DIEGO – JAN. 24, 2024 – Kyocera will exhibit its latest optoelectronic products and technologies at two upcoming events in San Francisco’s Moscone Center: SPIE Photonics West 2024 (Jan. 30 to Feb. 1), and SPIE AR/VR/MR (Jan. 30-31). In Booth #552...
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Kyocera Expands U.S.-Based Semiconductor Assembly Capabilities, Capacity, and Technology Investment
3 October 2023
- Corporate
- Semiconductor Components & Assembly Services
Company’s “one-stop solution” offers comprehensive onshore semiconductor packaging and OSAT services from 288,000sf facility in California
Read moreSAN DIEGO, CALIF. – Oct. 3, 2023 – Kyocera International, Inc. today announced an expansion of its U.S. semiconductor and microelectronic device assembly capabilities at its manufacturing operations in San Diego, Calif., where the company has produce...
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OFC 2023 Expo to Feature Kyocera’s Solutions for Next-Generation High-Speed Optics, Including Co-Packaged Optics with Superior Mechanical Reliability
24 February 2023
- Corporate
- Semiconductor Components & Assembly Services
Booth #4141 to showcase Kyocera packages and substrates supporting historic >5000X increase in optical data rates; March 7-9 in San Diego
Read moreSAN DIEGO — Feb. 24, 2023 — Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC®, the world’s largest optical fiber communication conference and exposition, ...
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KYOCERA Named Among "Top 100" Global Innovators for 7th Year by Clarivate
22 February 2023
- Corporate
- Semiconductor Components & Assembly Services
Read moreKyocera Corporation (President: Hideo Tanimoto) announced today that it has been recognized as a Top 100 Global InnovatorTM 2023 by Clarivate, a global leader in connecting people and organizations to intelligence that transforms the world. This year...
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SPIE Photonics West 2023 to Feature Kyocera’s Ceramic and Optical Components, Ceramic Package Solutions
26 January 2023
- Corporate
- Semiconductor Components & Assembly Services
Booth #5221 to showcase Kyocera components enabling new advances in optoelectronics, Jan. 31 – Feb.2, in San Francisco
Read moreSAN DIEGO — JAN. 26, 2023 — Kyocera, the world leader in Fine Ceramics, will exhibit its latest optoelectronic products and technologies Jan. 31 – Feb. 2 at SPIE Photonics West 2023 in San Francisco’s Moscone Center. In Booth #5221, Kyocera will pres...
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Kyocera Corporation and SoftBank Corp. Succeeded in Demonstration of Backhaul System Utilizing 5G Millimeter-Wave
15 July 2022
- Corporate
- Semiconductor Components & Assembly Services
Read moreKYOCERA Corporation ("Kyocera") and SoftBank Corp. ("SoftBank") conducted a backhaul system verification test utilizing the millimeter-wave band allocated to SoftBank for 5G (referred to as "5G millimeter-wave") at SoftBank base stations located in A...
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OFC 2022 Expo to Feature Kyocera’s Next-Generation, High-Speed Ceramic Packages for Optoelectronics
28 February 2022
- Corporate
- Semiconductor Components & Assembly Services
Booth #4728 to showcase Kyocera packages and substrates supporting historic >5000X increase in optical data rates; March 8-10 in San Diego
Read moreSAN DIEGO — Feb. 28, 2022 — Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC®, the world’s largest optical fiber communication conference and exposition, M...
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SPIE Photonics West 2022 to Include Kyocera’s Ceramic Package and Optical Component Solutions
17 January 2022
- Corporate
- Lens Components
- Semiconductor Components & Assembly Services
Booth #4314 to feature Kyocera components enabling new advances in optoelectronics, Jan. 25-27, in San Francisco
Read moreSAN DIEGO — JAN.17, 2022 — Kyocera, the world leader in Fine Ceramics, will exhibit its latest optoelectronic products and technologies Jan. 25-27 at SPIE Photonics West 2022, Booth #4314, in San Francisco’s Moscone Center — showcasing components tha...
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Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions
10 April 2019
- Semiconductor Components & Assembly Services
Collaboration will maximize AI performance and minimize time-to-market for new processor designs
Read moreAndover, MA and Kyoto, Japan– April 10, 2019 – Kyocera Corporation (TOKYO:6971) and Vicor Corporation (NASDAQ:VICR) will collaborate on next-generation Power-on-Package solutions to maximize performance and minimize time-to-market for eme...