OFC 2026 Expo to Feature Kyocera’s Solutions for Next-Generation High-Speed Optics, Including Co-Packaged Optics with Superior Mechanical Reliability

SAN DIEGO — Mar. 9, 2026 — Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC^®, the world’s largest optical fiber communication conference and exposition, March 17-19, at the Los Angeles Convention­­ Center. Click here or below for product details:

https://global.kyocera.com/prdct/semicon/search_application/detail/fo.html

For over 40 years, OFC has provided a showcase to define new markets while introducing new technologies for the advancement of fiber-optic communication. OFC’s exhibition floor represents the global optical communications supply chain, from sub-components and components to devices, modules, systems, and test equipment.

Kyocera, the leading manufacturer of fiber-optic device packages, has contributed significantly to the technology’s evolution by pioneering high-speed electrical routing within multilayer-ceramic substrates. The company’s early milestones in optoelectronics involved supporting the original U.S. broadband build-out and the optical network onboard the International Space Station. Since then, Kyocera products have supported an historic increase of more than 10,000X in optical communication data speeds — from early 155Mbps technology to 1.6Tbps today.

OFC 2026 will spotlight new advances in enhanced high-speed packages that Kyocera has been developing since last year’s show, as well as new ceramic material solutions for the evolving and highly promising technology of silicon photonics and advanced packaging expected to be widely adopted in Photonic-Electronic Convergence for AI networks. This year, Kyocera will exhibit ceramic solutions specifically engineered to build greater mechanical integrity and reliability into co-packaged optics and chiplets — which are attracting global attention as promising alternative technologies for reducing power consumption in data centers and AI networks.

Kyocera products on display at Booth #1921 will include:

High-Speed Ceramic Packages to Enable High-Speed 1.6Tbps Signals
- “GamoThru” high-speed RF ceramic technology

- High speed LTCC wire bond / flip chip substrates

- High speed multi-layer ceramic submounts

High Rigidity Build-Up Substrates for co-packaged optics and chiplet integration

• Ceramic-Core Build-Up Substrates with material options for chiplet boards
• Ceramic Stiffeners to enhance chiplet board rigidity

About KYOCERA

San Diego-based Kyocera International, Inc. is a wholly owned subsidiary of Kyocera Corporation.

Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of Fine Ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of ceramic components for a wide range of industries, as well as automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2025, the company’s consolidated sales revenue totaled 2.0 trillion yen (approx. US$13.2 billion). Kyocera appears on Forbes magazine’s 2025 “Global 2000” list of the world’s largest publicly traded companies and has been named by The Wall Street Journal among “The World’s 100 Most Sustainably Managed Companies.” In January 2026, Kyocera was named to Clarivate’s list of the “Top 100” Global Innovators for the fifth consecutive year.