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Semiconductor Components » Packaging » By Application » Radar / Antenna
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Radar / Antenna

Communications / Radar Systems

The challenge to the radar / communication system designer as the state-of-the art advances is to incorporate complex filtering, passive components, digital integration, power conditioning, routing, EMI mitigation, and thermal management in a single TR module.

TR Modules are utilized in advanced Radar and Radio Frequency (RF) systems including active electronically scanned arrays (AESA). Conventional RF systems generally operate at frequencies from 220 MHz to 94 GHz (VHF to mmW). The development of MMIC devices, ASICs, and GaN semiconductor technology has led to higher power output and wider usage of analog and mixed-mode module designs within the AESA.

Kyocera International has designed and manufactured more than 3,600,000 TR modules for numerous government radar programs, satellite communications, and other commercial applications. We have over 20 years of experience with TR modules and provide design optimization, electrical and thermal analysis, fabrication, assembly and testing capability in our R&D and manufacturing divisions in San Diego.

To meet the performance and low-cost packaging requirements of these systems, Kyocera International offers a variety of material sets, low-loss connectors, and proprietary design techniques to meet the stringent packaging requirements of airborne, seaborne, and ground system transmit/receive modules, digital and analog systems, and RF/microwave subsystems.

Antenna

Kyocera is the world's leading provider of ceramic packages in detector applications that require operation in the mm-wave frequencies. To operate systems and antennas successfully in these high frequency bands, low-loss dielectrics and high conductivity metals are matched together in material systems designed to deliver optimal performance in your antenna or sensor system.

Antenna array packages can be designed through W-band and above and utilize laminated waveguides typically constructed in low-temperature co-fired ceramic (LTCC). Antennas in HTCC can be fabricated for lower frequency applications. Typically an antenna array is comprised of the beam-forming network and the radiating elements. These array components can be fabricated to accommodate space limitations and provide excellent signal integrity in the transmission path to the radiating antenna surface