Telecommunication applications today must transmit multimedia data to more individual users, academic institutions, and an increasing global business base. The communications equipment accommodating the increase in demand for data requires robust packaging to maximize device and system performance. These packages are used extensively in the RF chain for power amplification typically for base station applications in the 500 MHz to 1.9 GHz frequency ranges and higher. Kyocera packages used in telecommunications applications include surface mountable ceramic, AlN, power electronics and mixed-signal packages.
At Kyocera, we are a leading supplier of power transistor packages to the wireless industry. These packages are used extensively in the RF chain for power amplification typically for base station applications in the 500 MHz to 1.9 GHz frequency range and higher. Package styles are available for LDMOS, GaN, SiC, BJT, SJ MOSFET and SiGe devices. We also have higher frequency package designs for MESFET, IMFET, PHEMT, InP and other MMIC applications.