Kyocera International utilizes the inherent hermetic capabilities of ceramic materials in the production of its image sensor and MEMS packages. Our sensor / MEMS packages are cost effective solutions to a wide variety of applications such as digital cameras, automotive, RF, military, video displays, scanners, toys and various medical applications. LCC, BGA, and SMT packages are often used for these applications. We offer assembly for sensor and MEMS devices in our class 1,000 and class 100 clean rooms in San Diego. For large volume requirements, Kyocera Corporation also offers wafer-scale packaging in Gamo, Japan.
- Cavity-style BGA or PGA