THE NEW VALUE FRONTIER
Semiconductor Parts » Packaging » By Type » BGA
  • Contact Us Today!

    If you have any questions about packaging technology or would like to discuss your requirements regardless of where you are in the design cycle or procurement phase, please click on the link above.

  • Follow us on LinkedIn!

    LinkedIn

BGA Packages

Kyocera offers a wide variety of Ball Grid Arrays (BGAs) ranging from C-BGAs and Kyocera's original high-reliability Dimpled BGAs (D-BGA), to HITCE BGAs with customizable thermal expansion. BGA packages are well-suited for high frequency applications and where increasing functional integration requires high-density routing and a large number of I/Os in a smaller footprint.

  • Shorter interconnection lengths provides improved signal integrity for high speed or high frequency designs
  • Provides electrical designers with advantages for power and ground distribution on the die
  • Overcomes wirebond pad pitch limitations
  • Parallel bonding process - All joints formed simultaneously

Flip chip and wire bonding options are available and have been engineered for numerous high-reliability applications including image sensors, satellite communications, high-performance telecommunications, and workstation servers.

Semiparts BGA