THE NEW VALUE FRONTIER
Privacy Policy & Notice to California Residents
Semiconductor Components » Packaging » By Type » Ceramic Quad Flat Pack (CQFP)
  • Contact Us Today!

    If you have any questions about packaging technology or would like to discuss your requirements regardless of where you are in the design cycle or procurement phase, please click on the link above.

  • Follow us on LinkedIn!

    LinkedIn

Ceramic Quad Flat Pack (CQFP)

Ceramic Quad Flat Packages (Cerquad) are a family of ceramic packages manufactured by the dry pressing method. Two dry pressed rectangular or square shaped pieces of ceramic (cap and base) are silk screen printed with solder glass and then glazed. The glass is then heated and a lead frame is embedded into the softened glass of the base, forming a mechanical attachment. Once the semiconductor device is mounted and wire bonded, a cap is placed on top of the assembly, heated to the glass melting point, and allowed to cool.

Semiparts Ceramic Quad Flat Pack