- Packaging
- By Application
- By Material
- By Type
- Antenna
- BGA
- Ceramic Package Lids
- Communication Modules
- Ceramic Quad Flat Pack (CQFP)
- Eyelet Power Packages
- Flip Chip Packaging and Assembly
- GaN & SiC Packages
- Hermetic
- LCC
- LDMOS
- MCM
- MMIC Packages
- Optoelectronic Components
- Organic Semiconductor Packages
- Power Transistor Packages
- Transmit / Receive Modules
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Packages (Cerquad) are a family of ceramic packages manufactured by the dry pressing method. Two dry pressed rectangular or square shaped pieces of ceramic (cap and base) are silk screen printed with solder glass and then glazed. The glass is then heated and a lead frame is embedded into the softened glass of the base, forming a mechanical attachment. Once the semiconductor device is mounted and wire bonded, a cap is placed on top of the assembly, heated to the glass melting point, and allowed to cool.