- Packaging
- By Application
- By Material
- By Type
- Antenna
- BGA
- Ceramic Package Lids
- Communication Modules
- Ceramic Quad Flat Pack (CQFP)
- Eyelet Power Packages
- Flip Chip Packaging and Assembly
- GaN & SiC Packages
- Hermetic
- LCC
- LDMOS
- MCM
- MMIC Packages
- Optoelectronic Components
- Organic Semiconductor Packages
- Power Transistor Packages
- Transmit / Receive Modules
Leadless Chip Carrier (LCC)
Kyocera's Multilayer Division utilizes the most state-of-the-art equipment, combined with a knowledgeable technical staff, to create high-quality, durable leadless chip carriers (LCC). The LCC package is preferred where requirements call out for a low-profile package or a surface mountable, solderable package with low inductance to be used in various commercial applications.