Flip Chip

The need for flip chip packages is growing and will continue to grow into the foreseeable future due to advances in integrated circuit technology. These advances in device performance are characterized by increased circuitry per area and much higher operating speeds. Electronic packaging is now critical to obtaining the best performance from these improved devices. Flip chip packaging offers the advantage of shorter electrical paths in a small footprint for better signal integrity and faster communication between devices. Flip chip packages are available in both ceramic and organic material sets.

Kyocera International established a dedicated flip chip assembly line in 1997 and recently expanded with a new state-of-the-art flip chip line in the beginning of 2012 to meet customer demands for a package manufacturer that can provide a secure, on-shore source for design, manufacturing, and assembly in one location.