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Hermetic Packages
In applications where the semiconductor device(s) must be shielded from the adverse effects of heat and moisture, hermetic packages provide the proper protection. Hermetic packages come in a variety of designs to meet demanding electrical and thermal requirements in numerous applications such as down-hole drilling, space, and medical.
The main feature of hermetic packages is a seal ring or other metallized component that allows the attachment of a ceramic or metal lid. For MEMS packages, vacuum sealing and getter utilization may be required and is available through Kyocera International's Assembly Technology Division.
Hermetic Package Options
