GaN & SiC Packages

Advances in compound semiconductor technology provide deployment of high-power solid-state electronics in diverse markets from replacement of Klystrons and TWTs for microwave applications to high-linearity power amplifiers in radar and communication systems. These devices require electronic packaging that provides effective thermal management or decreased signal-to-noise ratio, or both. Kyocera International offers enhanced package types and materials to meet the growing market for power semiconductor devices.

Open-tooled and custom module designs are also available in AlN and SiN.