- Packaging
- By Application
- By Material
- By Type
- Antenna
- BGA
- Ceramic Package Lids
- Communication Modules
- Ceramic Quad Flat Pack (CQFP)
- Eyelet Power Packages
- Flip Chip Packaging and Assembly
- GaN & SiC Packages
- Hermetic
- LCC
- LDMOS
- MCM
- MMIC Packages
- Optoelectronic Components
- Organic Semiconductor Packages
- Power Transistor Packages
- Transmit / Receive Modules
Communication and Radar Modules
Electronic circuitry for communications and radar applications have similar functions within the transmit and receive chains. The primary functions are the antenna where RF and microwave signals are captured and generated, intermediate frequency (IF) generation and processing, and analog / digital conversion and processing. The physical implementation of these and other circuit functions requires the right balance between IC device selection and optimized module design and materials. High frequency interfaces, both internal and external, are important packaging considerations for maintaining signal integrity. Kyocera International has extensive experience with advanced interconnect design as well as the design and incorporation of low-loss filters to help customers maximize performance in their communication or radar application.