- Packaging
- By Application
- By Material
- By Type
- Antenna
- BGA
- Ceramic Package Lids
- Communication Modules
- Ceramic Quad Flat Pack (CQFP)
- Eyelet Power Packages
- Flip Chip Packaging and Assembly
- GaN & SiC Packages
- Hermetic
- LCC
- LDMOS
- MCM
- MMIC Packages
- Optoelectronic Components
- Organic Semiconductor Packages
- Power Transistor Packages
- Transmit / Receive Modules
Transmit / Receive Modules
TR Modules are utilized in advanced Radar and Radio Frequency (RF) systems including active electronically scanned arrays (AESA). Conventional RF systems generally operate at frequencies from 220 MHz to 94 GHz (VHF to mmW). The development of MMIC devices, ASICs, and GaN semiconductor technology has led to higher power output and wider usage of analog and mixed-mode module designs within the AESA.
The challenge to the radar / communication system designer as the state-of-the art advances is to incorporate complex filtering, passive components, digital integration, power conditioning, routing, EMI mitigation, and thermal management in a single TR module.
Kyocera International has designed and manufactured more than 3,600,000 TR modules for numerous government radar programs, satellite communications, and other commercial applications. We have over 20 years of experience with TR modules and provide design optimization, electrical and thermal analysis, fabrication, assembly and testing capability in our R&D and manufacturing divisions in San Diego.
To meet the performance and low-cost packaging requirements of these systems, Kyocera International offers a variety of material sets, low-loss connectors, and proprietary design techniques to meet the stringent packaging requirements of airborne, seaborne, and ground system transmit/receive modules, digital and analog systems, and RF/microwave subsystems.